Following the successful extension of the wafer back-end portfolio by Under Bump Metallization (UBM) and Solder Balling, AEMtec enlarges now the wafer dicing segment. This investment in an additional wafer dicing machine and equipment for wafer cleaning including wat...

Scientists and engineers at the Fundación Markoptic in Culiacán, Mexico and the Universidad Nacional Autónoma de México (UNAM), Mexico City, have fabricated a novel device that could reduce the effects of glaucoma. They used Nanoscribe’...

Lasermet is pleased to announce the official opening of the new Research and Development Centre based in Cebu in the Philippines.  This inaugural event took place on 3rd October 2019 and was attended by the new design team, and hosted by the Lasermet Directors a...

The new Axetris LGD Graphical User Interface (GUI) is based on a simple desktop application. It allows customers to utilize new functions to communicate with the Axetris LGD sensors. Existing features are all still available. These features include displaying the mea...