AEMtec expands Wafer Back-end capacity

Following the successful extension of the wafer back-end portfolio by Under Bump Metallization (UBM) and Solder Balling, AEMtec enlarges now the wafer dicing segment.

This investment in an additional wafer dicing machine and equipment for wafer cleaning including water treatment, wafer mounting and UV exposure enables fast and reliable processing of numerous customer specific requirements.

With this step, AEMtec reacts on the positive feedback of its customers to the already available full services in the wafer back-end area.

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