One Component Epoxies from EpoxySet, Inc.
One component epoxy systems are ready to use, heat cure, epoxy adhesives, sealants, and small potting compounds.
The main advantage is that unlike 2-part systems which require accurate weighing, thorough mixing and vacuuming, one-component systems do not require any of the processing and ready to be used out of the container. Epoxyset offers a full
line of one component epoxy systems with a wide range of properties.
Top Performing One Component Epoxies
EB-350-4T
Epoxyset has a number of select Halogen free adhesives used for environmentally sensitive manufacturing.
Halogen free is defined as containing
EB-350-4T is a toughened, one component epoxy system with a shelf life of 3 months at ambient temperatures (25°C).
Shelf life can be extended by storing at lower temperatures (0-10°C). EB-350-3T is a thixotropic, non-sag epoxy ideal for screen printing applications. EB-350-4T is used highly in bonding ferrite cores for its high strength and ability to withstand solder reflow temperatures of up to 280°C (536°F). In semiconductor and PCB applications, EB-350-4T is excellent as a glob top encapsulant and dam material for dam-and-fill encapsulation.
EO-97M is a one component, silver filled epoxy adhesive that has a wide range of cure profiles. Needing a recommended minimum temperature of 80°C, it would take several hours to cure but may help prevent damage to sensitive components. It is also possible to “snap cure” EO-97M. What is snap cure? Snap cure is simply to cure the adhesive very quickly at very high temperatures. This generally leads to higher shrinkage than lower temperatures but this can be advantageous for electrical and thermal conductivity by increasing contact of conductive fillers. Snap cure is also beneficial in operation for efficiency and high output.
EO-97M is used to bond metals, ceramics, rubbers, and certain plastics used in electronic parts. Typical applications include bonding surface mount devices to flexible or rigid substrates, bonding of semiconductor elements; joining EMI and Rf parts; bonding electrodes, lead wires, and other connectors. EO-97M is used on electronic lead wires in military Doppler radars.
EC-350-1LV-M2 is a one component, room temperature stable glob top, underfill, or general encapsulating compound. It is one of the most versatile products for electronic assembly due to its low CTE, low viscosity, and long shelf life. EB-350-1LV-M2 also snap cures at high temperatures making it optimal for PCB applications. EB-350-1LV-M2 is a reworkable undefill. Reworkable underfills are a great option for low cost, flip chip technology. Removal of defective CSPs and BGAs is easily accomplished by heating the component and underfill to 220°C. Epoxy residues are easily scraped or brushed off.
