Development & Production of Optoelectronics

AEMtec is a global acting specialist for the development and production of a variety of precision optoelectronic products, including components, subsystems, modules and complete systems.
Precision optoelectronic products include Optical Assemblies, Micro-Optics, Imaging Arrays, VCSEL Assemblies, Sensor Systems, Optical MEMs, Hybrid Electronic Assemblies, Active and Passive Alignment.
With our broad technology portfolio, we are the right partner for sophisticated solutions in the area of miniaturization.
The range of services includes design and development, industrialization, qualification, prototyping (NPI), testing, serial production as well as supply chain management and after-sales services. www.aemtec.com

EXTENSIVE KNOW-HOW AND SERVICES IN NEW PRODUCT


DEVELOPMENT AND PROCESS ENGINEERING

  • Feasibility Study
  • Risk Analysis
  • DFM Analysis
  • Process and Test Development
  • Supply Chain Management
  • Traceability Concepts
  • Rapid Prototyping
  • Qualification and Industrialization
  • Pilot Production and Series Production

High Standard of Technological Equipment.

  • Cleanroom environment (ISO/class 5/100 to 8/100,000)
  • Wafer Back-End: UBM, Solder Ball Attach, Gold Stud Bumping
  • Chip on Board
  • Flip Chip
  • High Precision Placement
  • SMT
  • Box Build
  • Test and Analysis Equipment

CUSTOMER BENEFIT

AEMtec provides a complete service portfolio all along the value chain to ensure ideal conditions.
Customers gain value from the various assembly technologies offered from a single source. Rapid time-to-market of products secures customers’ competitive advantage.

AEMtec GmbH – News

AEMtec delivers ‘one-stop-shop’ for optical component requirements

If you need help with wafer treatment, preparation and packaging, offering advice on product and process development as well as volume production - all from a one-stop-shop, the company AEMtec could be your solution.  AEMtec was set up i

AEMtec expands Wafer Back-end capacity

Following the successful extension of the wafer back-end portfolio by Under Bump Metallization (UBM) and Solder Balling, AEMtec enlarges now the wafer dicing segment. This investment in an additional wafer dicing machine and equipment for wafer cl