Founded in 1988, HOYA Candeo Optronics focuses on optical laser, UV and electro-optical (EO) glass equipment with a worldwide incomparably product and customer service quality.
In order to meet the increased needs of European customers with focus on color filter glass and opto-electronics glasses, HOYA Candeo Optronics has established its European branch in 2013, which is now located in Mönchengladbach, Germany. With a stock in Germany, ordered items can reach the customer within 2-3 days. Local customer’s concerns can be handled much faster and more efficiently now.
HOYA Candeo Optronics manufactures the world’s highest quality monolithic color filter glass from ultraviolet to infrared spanning. We provide color glass filters for a wide range of fields such as cameras, optical instruments, physics and chemistry, educational materials, industrial and medical, with spectral characteristics and size according to your requirements. The color filter glass can be supplied either at polished 50x50xt2.5mm dimensions, unpolished 165x165xt4-5mm dimensions or pursuant to your specifications with a thickness as low as t0.5mm.
We sell not only colored glass filters, but also filters that have been coated on crown glass or optical glass substrates.
We manufacture and sell special glass used in various fields including electronic glasses which are often used in the electric and electronics industries.
Hoya’s SD-2substrate is designed with a coefficient of thermal expansion curve which closely matches Si single crystal.
Borosilicate glass has been widely used as a bonding material to Silicon Wafer. CTE curves of Borosilicate glass and Silicon Single Crystal Wafer cross at about 240C. When anodic bonding is performed at 400C, the difference of the expansions at high temperature creates residual stress in the Si chip during cooling down to room temperature. As precision of LSI circuit patterning moves to less than 0.25 microns, distortion between the silicon and glass wafers becomes a critical issue. Hoya’s SD-2 substrate is engineered to minimize the distortion or bowing effect caused by the thermal mismatch between the twowafers.
During the bonding process, a small amount of Na ions, engineered into SD-2 move as electro conductive carriers to facilitate a very short bonding time. It is applicated in the fields of silicon wafer bonding, photolithography, pressure sensors, displacement sensors and semiconductors.