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AEMtec expands Wafer Back-end capacity

Following the successful extension of the wafer back-end portfolio by Under Bump Metallization (UBM) and Solder Balling, AEMtec enlarges now the wafer dicing segment. This investment in an additional wafer dicing machine and equipment for wafer cl

Nanoscribe: New development

Scientists and engineers at the Fundación Markoptic in Culiacán, Mexico and the Universidad Nacional Autónoma de México (UNAM), Mexico City, have fabricated a novel device that could reduce the effects of glaucoma. They us

Lasermet launches new R&D centre

Lasermet is pleased to announce the official opening of the new Research and Development Centre based in Cebu in the Philippines.  This inaugural event took place on 3rd October 2019 and was attended by the new design team, and hosted by the

Fastest Thickness Measurements with Terahertz Pulses

TeraFlash smart: Ultrafast Time-Domain Terahertz Platform TOPTICA's new time-domain terahertz system TeraFlash smart sets new standards in terms of measurement speed: The system records up to 1600 pulse tracks per second, enabling real-time la

Caeleste: New ELFIS imager

The ELFIS imager is the first image sensor ever combining following features: True HDR or “MAF HDR”, motion artifact free HDR Global shutter using GS technology, Allowing low noise CDS readout Enabling Global Shutter (IWR

Nanoscribe receives Innovation Award

At the LASER World of Photonics in Munich, we received the Innovation Award for the most innovative product for our brand-new maskless lithography system Quantum X. The award is sponsored by the trade fair and the British specialist publish