As one of the world‘s leaders in optical glass making and technology, HOYA Group extended its business in the field of photonics and optics with the establishment of HOYA CANDEO OPTRONICS in 1988. The Candeo (Latin = “shine”) branch focused on optical laser, UV and Electro-optical (EO) glass equipment with a worldwide incomparably speedy and efficient product and service quality.
In October 2013 HOYA CANDEO OPTRONICS has established its European branch in Eschborn, Germany in order to meet the increased needs of European customers with focus on colored glass filters and opto-electronics glasses. The purpose is to apply the very high Japanese service standards also to the European market. With a stock in Germany ordered items can reach the customer within one day. Local customer’s concerns can be handled much faster and more efficiently now.
HOYA CANDEO OPTRONICS has recently developed and released a new UV transmitting and visible light absorbing band-pass black filter with top quality and excellent optical properties at an attractive price level.
The filter exhibits high performance of solarization for high energy UV lamps and UV LEDs. Even after exposed to very high intensity UV light, the peak will degrade very slowly.
HOYA UL365S has better performance in humidity tests than the other equivalent glass. The Surface condition under harsh environment will not change at all.
HOYA UL365S complies with RoHS Directive (2011/65/EU) and does not contain harmful substances like Lead, Cadmium or Arsenic. Potential applications include fluorescent flaw detection, biomedical, entertainment and UV curing.
HOYA CANDEO OPTRONICS manufactures and markets the world’s highest quality monolithic color filter glass from ultraviolet to infrared range. Their field of application reaches from Machine vision, CRT displays/LCD/ FED, CCD/CMOS, UV Transilluminator, Electronic Instrumentation, Night Vision, Imaging, Calibration, Telecommunication to the field of medical devices.
The “Color Filters” can be supplied as polished 50x50xt2.5mm dimensions, unpolished 165x165xt4-5mm dimensions or according to your specifications with a thickness as low as t0.5mm. A wide range of coatings can also be applied.
Hoya’s SD-2 substrate is designed with a coefficient of thermal expansion (CTE) curve which closely matches Si single crystal.
Borosilicate glass has been widely used as a bonding material to Silicon Wafer. CTE curves of Borosilicate glass and Silicon Single Crystal Wafer cross at about 240C. When anodic bonding is performed at 400C, the difference of the expansions at high temperature creates residual stress in the Si chip during cooling down to room temperature. As precision of LSI circuit patterning moves to less than 0.25 microns, distortion between the silicon and glass wafers becomes a critical issue. Hoya’s SD-2 substrate is engineered to minimize the distortion or bowing effect caused by the thermal mismatch between the two wafers.
During the bonding process, a small amount of Na ions, engineered into SD-2 move as electro conductive carriers to facilitate a very short bonding time. It is applicated in the fields of silicon wafer bonding, photolithography, pressure sensors, displacement sensors and semiconductors.