Nanoscribe’s software DeScribe offers new features. The recent release Describe 2.5 contains novel and quick workflows for handling STLs that ease the search for writing parameters and speed up processing STLs in a batch. As the previous version, DeScribe runs Nanoscribe’s standard recipes as well as customized ones.
These optimized parameter sets in these recipes are the most suitable writing settings (such as layer spacing, line spacing and scan speed among others) for specific writing requirements, e.g., for filigree or bulky structures. Hence, in order to start working with DeScribe all the user needs is an STL file with its structure design and a recipe.
When a specific 3D object or material has no recipe available, for example when self-made resins come into play, a new software feature helps with the search for the best printing parameter set. The new Parameter Sweep workflow creates an array of one and the same STL design with varying writing parameters along the x- and y-axes.
For example, when testing new materials for well-defined structuring, a throughput test can be performed with a set of different slicing/hatching distances and varying scanning speeds (see image). Without the need to write a script manually, the software loads the desired STL design and offers this ready-to-use parameter search option. Once the printed array is inspected, it is possible to identify the most suitable parameter set, in this case the combination of slicing/hatching distance and scanning speed, through the label attached.
This parameter combination can then be saved as a recipe which can later be retrieved with a single mouse-click whenever a similar application is in sight. That way it is much faster and less error-prone to find out which setting combination works for a new type of material without occupying unnecessary printing time.